Remember the Huawei Ascend P1 S from CES, the high-end smartphone running a 1.5Ghz dual-core TI OMAP processor running Android 4.0 and only 6.68mm thick? Well Huawei is saying that’s old news. Well that’s what they told TWICE when Richard Yu said:
The two Ascend phones will be followed by a Diamond series of smartphones that will take performance a step higher.
Looks like in February at MWC congress we are going to see something really big coming from Huawei and it is most likely going to be really exciting.
My predictions is we will see thinner than the 6.68mm thin PS 1, we will see a quad-core processor, 720P resolution and most certainly running Android 4.0